Tin And Lead Solders

Tin, lead and their alloys, due to their low melting temperatures and wide availability, are the most commonly used solder materials.

 

Tin

TS

SS

E

EM

IIS

SG

TEC

0

12

12

55

18

8

11

29

5

28

14

45

18

10

11

28

10

30

17

30

19

11

11

28

20

33

20

20

20

15

9

27

30

34

28

18

2

16

10

26

40

37

32

25

24

19

9

25

50

41

36

35

27

20

9

24

60

52

39

40

30.0

20

9

22

63

54

37

37

32

20

8

21

70

54

36

30

35.0

19

8

21

 

  • Tin = (wt.%)
  • TS = Tensile Strenght (MPa)
  • SS = Shear Strength (MPa)
  • E = Elongation (%)
  • EM = Elastic Modulus (GPa)
  • IIS = Izod Impact Strength (J)
  • SG = Specific Gravity (gm/cub cm)
  • TEC = Thermal Expansion Coefficient (10-6/°C)

 

* These are only indicative values and should be correctly calculated, when used in any design or application.

 

 

As can be seen from the above table, the 63% tin 37% lead solder alloy results in the maximum tensile strength, shear strength, impact strength, and resistance to creep. This 63-37 composition is also known as the eutectic point of the alloy, where the alloy behaves like a pure metal having a single melting (solidification) temperature (176ºC / 349ºF). This is a good operational feature. Once the solder melts on application of heat, it solidifies immediately on removal of heat, without going through a pasty stage like other alloys. This allows for predictable soldering and fast cycle times.