STENCILS

High stability, high-precision solder printing

  • Screens for stable printing with high pitch precision
  • Uniform, stable solder applied volume
  • Lazer-processed according to customer configuration
  • Various types available to customer specifications
  • Min. hole diameter: Ø 30 μm (for board thickness 30 μm)
  • Hole diameter precision with 5 μm
  • High pitch precision: Within 20 μm (per pitch 200mm)

Example of Cutting Quality
Opening diameter : Ø 0.150mm
Board thickness: 0.040mm

Before After